Ultra
Published: 2026-07-21 • Permanent link
Researchers at The Hong Kong University of Science and Technology (HKUST) have developed a novel chip architecture that enables the miniature acoustic devices inside smartphones to withstand more than 12 times higher power loads while maintaining cooler, more...
More details are emerging as this story continues to develop. Stay with Banking With Billy for ongoing coverage and analysis.
More details are emerging as this story continues to develop. Stay with Banking With Billy for ongoing coverage and analysis.
Why it matters: Researchers at The Hong Kong University of Science and Technology (HKUST) have developed a novel chip architecture that enables the miniature acoustic devices inside smartphones to withstand more than 12 times higher power loads while main...
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